About Us

Ertek's ink comprises inexpensive, commodity electrically conductive fillers and proprietary additives. The nature and concentration of the conductive fillers alone impart conductivity insufficient to allow for practical direct electroplating. For example, the conductivity of Ertek's printed ink patterns is typically in the range of 20,000 ohms. However, Ertek's additives allow for direct and continuous electroplating by performing the following critical functions:

• They force the rapid lateral growth of the metal electro-deposit over the surface of the ink; and
• They promote a chemical bond between the metal and the in. This chemical bond results in excellent adhesion between the metal and ink and dramatically increases design flexibility compared to other plateable inks that rely on a mechanical bond.

It is important to note that unlike conventional plateable inks, Ertek's technology allows for direct and selective metal electro-deposition. Many conventional plateable inks require that the initial metal layer be deposited with electroless plating. This is significantly more complicated and expensive than Ertek's process. Ertek is aware of no other low-cost, semiconductive ink that can be directly and continuously electroplated.




























UNIQUE NATURE OF ERTEK'S INK